IBM hope against hope provide a deeper look
into its exert yourself on 3-D imperfection stacks by the International
Electron diplomacy summit (IEDM) at this time, detailing exert yourself on
stacks of 45-nm member of staff serving at table processors with reminiscence
and transceivers.
Extensive Blue has lengthy been probable to
be located surrounded by the the first part of users of 3-D stacking to match
up its member of staff serving at table CPUs with memories on behalf of
performance and power advantages. It has been collaborating with Micron on the
Hybrid reminiscence Cube, a reminiscence stack on behalf of scarcely such
applications.
“As scaling
saturates, and lithography sputters to a grinding halt, these orthogonal
scaling techniques hope against hope take for granted even supplementary
magnitude and last to keep Moore’s ‘law’ alive,” wrote Subraman S. Iyer, a
senior IBM technologist all the rage the IEDM paper to be located presented
Wednesday (Dec. 12).
The paper shows IBM’s road plot extending from
embedded DRAM to various 3-D stacks with and exclusive of interposers using
face-to-face and back-to-back stacks. All the rage a separate paper, IBM
disclosed the top two layers of metal all the rage its in mint condition 22-nm
process are optimized on behalf of function with through silicon vias
looked-for on behalf of 3-D stacks.
“Embedded
DRAM, 3D stacking, interposers and wafer-to-wafer integration are intrinsic to
this [IBM] roadmap,” Iyer’s paper understood.
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